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Thin Quad Flat packages TQFPs are a low-profile QPF variation. The short wire bonds are indication to down bonds e.g. rev2023.3.3.43278. This package type was introduced to increase the package density of DRAM. The extensions shield the leads against any mechanical damage before you solder this package onto a PCB. Furthermore, QFNs come with an open thermal pad fixed below the package. A low-profile quad flat package (LQFP) is a surface mount integrated circuit package format with component leads extending from each of the four sides. They bear one significant advantage that sets them apart from rectangular QFPs: Since we stated one significant advantage of using square QFP packages, how about a disadvantage to even things out: For QFP-PCB assembly, follow the following procedure: Apply soldering paste onto the PCB metal pad by stencil printing. One for all standardized land pattern v.s. Inversely, TQFP packages can have a maximum thickness of 1.4 mm. Dibutyl phthalate (DBP): 0.1% (1000ppm), 10. Network resistors also use these packages. Other special variants include low profile QFP . Additionally, you can purchase them in different die types. Copper lead-frames are used for this dummy component package. TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes. Main ceramic package manufacturers are Kyocera, NTK, and offer the full pincount range. If you preorder a special airline meal (e.g. This package allows IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs and thin endproduct profile. Add to cart Another side for pin pitch size 0.8mm can be used to convert SOP32, SSOP32 to DIP 2.54mm. Polybrominated diphenyl ethers (PBDE): 0.1% (1000ppm). It would be best to utilize type 4 pastes for this procedure as they are more effective. Standard QFP packages have mold compound which encompasses the entire bottom side of the package, while the EP . Generally, large-scale or very large-scale integrated circuits use this In the form of packaging, the number . You can use an accuracy and precision tool to accurately fit your component, even with the excessive interconnection density issue. Copyright 2023 WTWH Media LLC. Integrated Circuits rule the world of electronics. A fourth way to distinguish IC packages is by terminal count. Pins on a QFP IC are usually spaced anywhere from 0.4mm to 1mm apart. Why do small African island nations perform better than African continental nations, considering democracy and human development? The die has all its components and interconnections fabricated at a microscopic level. No: Not compliant to TI Green definition. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Thermocouples help you monitor QFN surface temperature. The REACH SVHC list is usually updated 2 times per year and the REACH Annex XVII list updated as needed. Low Profile Quad Flat Pack (LQFP) is a surface-mount IC package with leads extending from all around four sides of the package body. Square they have the same number of pins on each side as they have the same length. Redoing the align environment with a specific formatting. My datasheet says TQFP but has no recommended land pattern. Around 0.8 mm thick. With the knowledge gained from this article, you can make great IC choices without breaking a sweat. TQFP package having total height less than 1.2mm, said package named Thin profile Quad Flat Package. To make sure that these devices are safe, you should store them carefully to minimize the chances of damage. Normal QFPs, on the other hand, utilize imperial measurements. For example, for semiconductor components with heat sinks, inductors, and transformers, through-hole mounting is ideal. So now you know why it is known as a punch-type QFN. The final step in creating a semiconductor device is integrated circuit packaging, which involves encasing the semiconductor material block (on which a given functional circuit isfabricated) in a protective case to protect it from physical harm and corrosion. Low-profile Quad Flat packages or simply LQFPs are based upon MQFP and QFP metrics. A DIP IC can also be easily soldered on PCBs. TQFP vs. LQFP How are they different, and are these the only differences? Asking for help, clarification, or responding to other answers. The pins just touch the PCB making the soldering process pretty easy. A variety of techniques for interconnecting several chips within a single package have been proposed and researched: Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. Portions that get heated up faster become lighter, and those that get heated up much later are the ones that have more copper on them. Broadly, with the above-mentioned criteria, all different IC packages can be easily distinguished. Soldering QFNs is pretty crucial in the assembly activity. Array carrier features quite large cost due to fine line circuits and chemical processing technology. Quad flat No-lead packages and Quad flat packages are both pretty impressive devices. Low profi le Quad Flat Package VQFP. Search. This package is a variant of the CERDIP package. Hexavalent Chromium (Cr6+): 0.1% (1000ppm), 4. Use MathJax to format equations. Well, this happens due to temperature variation within your reflow oven. Why have the same chip in the same package, but with a different number of pins? Making statements based on opinion; back them up with references or personal experience. And on top of that, it also has heat spreaders which allow higher power levels dissipation to improve efficiency. The leadless types have electrode pads as the terminals for the connections. Hi, I am Hommer Zhao, the founder of WellPCB. LQFP package having total height less than 1.7mm (including 1.7mm) and more than 1.2mm (no including 1.2mm), said package named Low profile Quad Flat Package. Note that excessive soldering paste causes solder bridging. These IC packages have a smaller pitch (50 mils) and were designed for US military standardized PCBs. TQFP vs. LQFP: The Major Difference Thin Quad Flat Package (TQFP) is often compared to the Low-profile Quad Flat Package (LQFP) because they both belong to the broader Quad Flat Package (QFP). The LQFP offers pin counts up to . Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25mm 0.125mm (0.0098in 0.0049in),[32] but the imperial 01005 name is already being used for the 0.4mm 0.2mm (0.0157in 0.0079in) package. QFP vs. QFN: QFP Packages QFP is an acronym for Quad Flat Package. Normally, electronic components are available in multiple IC packages to suit different phases of product development (like prototyping and production) and suit different circuit design considerations. The leads are vertically arranged along the boundary line of the package. This is helpful and easy to understand the article for the beginners! Pins are numbered counter-clockwise from the index dot. Lead pitches available for TQFPs are 0.4mm, 0.5mm, 0.65mm, 0.8mm, and 1.0mm. To learn more, see our tips on writing great answers. These QFNs are composed of three sections, namely: These QFNs are pretty pricey compared to other QFNs due to their construction. There are various pin pitches such as 1.0mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, and 0.3mm. Another dimensional change suffered by this package is board flexure. The current language is English.Forward to English site? This IC has two parallel rows of pins extending perpendicularly out of a rectangular plastic housing. Even though QFNs are pretty efficient, PCB designers tend to have an issue with them. TQFP is short for Thin Quad Flat Package, a type of surface-mounted integrated circuit package with connections all around the periphery. QFP: quad flat package . Sometimes, an IC socket is used instead of soldering an IC directly to the PCB. Yes: Fully compliant to TI Green definition. Usually, special automated tools are used to solder these on PCBs. After all, they are both quad-flat packages. To subscribe to this RSS feed, copy and paste this URL into your RSS reader. pjr (Customer) Edited by ST Community July 21, 2018 at 5:40 PM. QFNs perform well when they hit high-volume, low-mix products. It is one of the most popular variants of the QFN package. Accuracy and precision are pretty crucial for this part. PLCC is QFJ of plastic, and the . These two sections are then glued together to form a complete QFP package. Circuit Board Fabrication and PCB Assembly Turnkey Services WellPCB - Circuit Board Fabrication and PCB Assembly Turnkey Services, 3rd Floor, Nanhai Plaza, NO. If this two are not accurate then the results will be catastrophic. SMD IC packages usually need custom PCBs, containing a matching pattern of copper on which they are to be soldered. The nature of simulating nature: A Q&A with IBM Quantum researcher Dr. Jamie We've added a "Necessary cookies only" option to the cookie consent popup. These amazingly intricate packages have small balls of solder arranged in a 2D grid on the bottom. LQFP is a low profile (1.4mm) version of the QFP. TQFP vs LQFP: What is the Difference Between Packages #package #TQFP #LQFP #ic E.g. By definition, a QFP with 256 pins means that it would typically have around sixty-four pins protruding on either side of the package. PQFP (Plastic Quad Flat Package) is a form of chip packaging. After solder paste printing, you can then move on to embedding your QFN integrated circuit onto your PCB based upon your PCB layout design. For example, below is a screenshot of a table of IC packages from an online chip supplier. Expand Post. Regular QFP are 2.0 to 3.8 mm thick depending on size. These IC packages are the surface-mount type with no leads. These packages are useful in reducing the PCB cost by eliminating the need to reduce the wiring pitch. Seam welding gives rise to significantly less temperature rise in the internal of the package (e.g., the die attach). Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Applications for this robust package can include commercial, automotive, and industrial products. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. They have a height of 1mm and a standard lead-frame footprint of 2.0mm. STM32F103 microcontrollers use the Cortex-M3 core, with a maximum CPU speed of 72 MHz. The terminals can be L-shape, J-shape, or leadless. There are unique rework stations available for this specific purpose. Is it possible to solder LQFP package to board designed for QFP? Also, make sure the bond pad design lies at a range of 0.2 0.3 away from your package footprint. The common surface-mount small-outline packages are SOP (Small Outline Package), CSOP (Ceramic small-outline package), DSOP (Dual small-outline package), HSOP (Thermally-enhanced small-outline package), SSOP (Shrink Small Outline Package), TSOP (Thin-Small Outline Package), TSSOP (Thin-Shrink Small Outline Package), TVSOP (Thin very-small-outline package), MSOP (Mini/Micro Small Outline Package), HSSOP (Thermally-enhanced shrink small-outline package), HTSSOP (Thermally-enhanced thin shrink small-outline package), QSOP (Quarter Small Outline Package), SOIC (Small Outline Integrated Circuit), mini-SOIC (Mini small-outline integrated circuit), SOICW (Small Outline Integrated Circuit Wide), PSOP (Plastic small-outline package), PSON (Plastic small-outline no-lead package), VSOP (Very-small-outline package), VSSOP (Very-thin shrink small-outline package), SOJ (Small Outline J-leaded package), SON (Small Outline Non-leaded package), VSON (Very-thin Small Outline Non-leaded package), WSON (Very-very-thin small-outline no-lead package), and USON (Very-very-thin small-outline no-lead package). The aperture-pad ratio should also be 0.8:1 or within that range for optimum results. TIs latest RoHS statement is found on our Environmental information page. What are the battery-selection criteria for low-power design? The exposed pad is an extra pad underneath or on top of the QFP that may act as a ground connection and/or as a heat sink for the package. QFP (Quad Flat Package) is a gull-wing (L-shaped) package with leads coming out of four sides of the package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. Tools & Software. QFP typically have 32 to 208 pins placed in a pitch of 0.4 to 1 mm. Some QFP packages have an exposed pad. The heat dissipated by this IC needs to be ejected from them for better performance. To . These packages are manufactured using plastic. Amkor's TQFPs are an ideal . You can now work basing on your intended design with this two in place. They also check the package body temperature does not surpass any typical values. After de-soldering, you can now move on to mechanically removing the component from your PCB. TI products that are compliant to RoHS requirements are also fully compliant to the substances and thresholds defined in the IEC 62474 Database (was previously the Joint Industry Guide). However, you still need to place the component carefully. This makes it easier to mount than TQFP. QFP pins are pretty small, plus they have small spacings. Connect and share knowledge within a single location that is structured and easy to search. This button displays the currently selected search type. QFPs are surface mounted and can be thermally enhanced through an exposed pad. Typically 1.4 mm thick. It is an SMD with all DIP pins bent outwards and shrunk down to size. Nevertheless, we can use both packages in similar applications as they are both low-profile packages. Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame. In flip chip systems the IC is connected by solder bumps to a substrate. Learn more about Stack Overflow the company, and our products. The overall dimensions of a DIP package depend on its pin count. MathJax reference. Quad Flat J-leaded package QFP . 2. qjc for CG624 refers to the thermal resistance between the junction and the top of the package. Free e-zine with select content and advertisements of Electronics For You. Lead count ranges from thirty-two to two hundred and fifty-six, Body size ranges from 28 x 28 millimeters to 5 x 5 millimeters, Lead pitches comes in four different variations: 0.3, 0.4, 0.5 and 0.65mm, They let the QFP package bear high density compared to rectangular packages, During transportation, these QFPs are damaged easily compared to rectangular packages. The advantage of MAXQFP as compare to standard LQFP/QFP packages will be outlined. One major QFP issue is how easily the lead pins get damaged or bent. By clicking Accept all cookies, you agree Stack Exchange can store cookies on your device and disclose information in accordance with our Cookie Policy. Start by carrying out a pre-bake procedure; this will help avoid any failures related to moisture. Both packages are similar in that manufacturers use them in cost-conscious applications. 0.1in (2.54mm) pin spacing, rows 0.3in (7.62mm) or 0.6in (15.24mm) apart. Nevertheless, we can use both packages in similar applications as they are both low-profile packages. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. The leads are arranged horizontally in two or four rows with surface-mount style. Another vendor or manufacturer might use a different scheme. If you can't find a land pattern from the IC manufacturer then check very carefully the pin pitch and package size when trying to find a compatible footprint. Lead counts range from 32 to 176. These are surface-mounted packages with the leads extended out to the four sides of the package. These package types have two rows of terminals and a surface-mount mounting style. The number of bonding decks can be one, two or three. There are many types of IC packages, each having unique dimensions, mounting styles, and pin counts. The J-leaded packages were developed to reduce the space required on the substrate. Most ICs with 6 to 40 pins have at least DIP as one package type. Well, here is how. Lead pitch values used by CQFP's range from 0.5 mm to 1.27 mm. A very large number of different types of package exist. LQFPs have an exposed die pad on the bottom of the package, which is created by an appropriate lead frame down-set. QFP (Quad Flat Package) is a quad flat package, a surface mount package with pins leading from all four sides in a seagull wing (L) shape. What is a QFP? "A thin quad flat pack (TQFP) provides the same benefits as the metric QFP, but is thinner. The measurement should hence be pretty accurate. SMD devices such as rectangular transistors are available in SOT packages. This will stiffen the assembly and cause solder joints to fatigue earlier than in a design in which the components are offset. Site design / logo 2023 Stack Exchange Inc; user contributions licensed under CC BY-SA. Make your turnkey PCB assembly with components sourcing service at MADPCB. Amkor offers a broad line of TQFP (Thin Quad Flat Pack) IC packages. The electronic components come in a variety of packaging. Generally, these packages are extensively utilized by very large-scale and large-scale ICs. These IC packages are distinguished because they have almost the same size as the underlying silicon wafer. If you have any questions, you can feel free to contact me! LQFP - Low-profile Quad Flat Pack. Also, this leadless IC package is effective for connecting the IC's silicon die to the printed circuit board. After this process, a saw shall cingulate the formed pins and rows, and then you will have a multiple-row QFN. Chip-on-flex (COF), a variation of COB, where a chip is mounted directly to a, Chip-on-glass (COG), a variation of COB, where a chip, typically a. Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire. Amendment EU 2015/863 released on 4 June 2015 and comes into effect 22 July 2019 that added 4 phthalates to the list of 6 restricted substances: 7. Quad Flat Package and Quad Flat No-leads Packages: Taking Care of Your Complex ICs The most common IC package types for larger critical components such as microcontrollers are the QFP (Quad Flat Package) and QFN (Quad Flat No-leads) packages. Finally and most important, it decides how electrical contacts are laid out from the semiconductor device over a PCB. SSOP : 0.65mm/0.80mm/ 1.00mm LQFP : 0.40mm/0.50mm However, this is not necessary for the creation of reliable joints. The terminals may be through-hole type in needle shape (like PGA (Pin Grid Array), OPGA (Organic pin-grid array), FCPGA (Flip-chip pin-grid array), PAC (Pin array cartridge), CPGA (Ceramic pin-grid array), SPGA (Staggered Pin Grid Array), CGA (Column Grid Array), CCGA (Ceramic Column Grid Array)), surface-mount type with solder ball leads (like BGA (Ball Grid Array), EBGA (Enhanced BGA), eWLB (Embedded wafer level ball grid array), FTBGA (Flex Tape BGA), TFBGA (Thin & Fine-Pitch Ball Grid Array), FBGA (Fine-pitch ball-grid array), LBGA/LFBGA (Low-profile ball-grid array), TEPBGA (Thermally-enhanced plastic ball-grid array), CBGA (Ceramic ball-grid array), OBGA (Organic ball-grid array), TFBGA (Thin fine-pitch ball-grid array), PBGA (Plastic ball-grid array), MAP-BGA (Mold array process ball-grid array), UBGA (Micro ball-grid array), TBGA (Thin ball-grid array), SBGA (Super ball-grid array), and UFBGA (Ultra-fine ball-grid array)) or leadless surface-mount having electrode pads (like LGA (Land Grid Array)). For example, the following is a screenshot of the package line-up from Fujitsu. Is it possible to create a concave light? This is an important consideration for both IC designing as well as PCB designing. A square or rectangular array of solder balls on one surface, Thermally-enhanced plastic ball-grid array, Center pin is connected to a large heat-transfer pad, Tapered body, one larger pad denotes terminal 1, One terminal is a large heat-transfer pad. An example for calculating the ppm gold content follows. A QFP IC can have pins anywhere from eight per side (32 total) to upwards of seventy (300+). Latest Tech trends. TIs full definition of Green is within the TI Low Halogen (Green) Statement found on our Environmental information page. After that, sort the sawn types to conclude the process of creating a sawn-type QFN package. One side for pin pitch size 0.8mm can be used to convert QFP32, TQFP32, LQFP32, or FQFP32 to DIP32 2.54mm. HTQFP, HLQFP, LQFP, MSQFP FOOTPRINT (WAVE SOLDERING) Wave soldering PACKAGE NAME PHILIPS OUTLINE CODE Nx Ny FOOTPRINT DIMENSIONS (mm) PLACEMENT P Ax Ay Bx By C D1 D2 THS W ACCURACY HTQFP32 SOT-547-1 Not suitable for wave soldering. Why are physically impossible and logically impossible concepts considered separate in terms of probability? The common single in-line packages are SIP (Single In-line Package), SSIP (Shrink Single In-Line Package), HSIP (Single In-line Package with Heat Sink). Self-alignment that occurs because of the surface tension of the liquid solder support reliable solder joint formation. TQFP - Thin Quad Flat Pack. Flip-chip is less expensive molded QFN package that utilizes flip-chip interconnectivity onto copper lead frame. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).[2]. Therefore, as a designer, you can visually check to ensure that the pads are appropriately mounted onto your PCB. In surface-mount packaging, the component is mounted directly on the exterior of the PCB. The discrete form is reserved for standalone components only, like a transistor, diode, resistor, capacitor, or inductor. The packaging of an integrated circuit is as important as the integrated circuit, the semiconductor device within. MC9S08AW60CPUE vs MC9S08AW60MPUE Compare result: MC9S08AW60CPUE ,MC9S08AW60MPUE . The drawing below show the package structure difference between a punched and sawn QFN. So far, we have more than 4,000 customers worldwide. Thank you, I'm aware of the different pitch variations. Thickness from 2 mm up-to 3.8 mm. However, some smaller QFPs might have only thirty-two pins, which means they have eight pins on either side. Since QFN packages have narrow pad-to-pad pitches, this poses a soldering issue known as solder-bridging. Enough to scare off, all those fancy terms DIP, SIP, SOP, SSOP, TSOP, MSOP, QSOP, SOIC, QFP, TQFP, BGA, etc., are all names different IC packages. I made PCBs for HT1632c chips, but they retiring QFP package and switching to LQFP. Example: ppm= 1,000,000 * total amount of gold in component (mg) / total component weight (mg), Gold mass = 0.23mg & Component mass = 128mg, 1,000,0000 * 0.23 mg gold / 128mg component = 1,797 ppm. These can be used with breadboards and prototyping boards as well. They have a standard lead-frame footprint of 2mm. Usually, putting these packages onto a PCB requires an automated procedure involving pick-and-place machines and reflow ovens. In the past, the only difference between the two was that the former used plastic and the latter used ceramics. In through-hole packages, the IC leads are designed to be inserted through holes on the PCB before soldering. They connect to these components using wires connected to the chips terminal. They have been around for decades and are still widely used. Pads are spaced along the sides of the IC with an exposed die that can be used as ground. Therefore, it would help if you stuck strictly to the guidelines provided by the manufacturer. Table 1 . These solder balls melt during soldering and make the connection between the PCB and component. Quad Flat Pack (QFP) 102 total package options for the Texas Instruments Quad Flat Pack (QFP). Then, a punch tool splits the molded cavity. The Low Profile Quad Flat Pack, or LQFP, is a surface-mount IC package with leads extending from all four sides of the package body. Lightweight and thin package solution. Package Size (mm) Lead Count LQFP 7 x 7 32, 48, 64 10 x 10 44, 64, 80 14 x 14 64, 80, 100, 120 20 x 20 144, 176 24 x 24 176 28 x 28 208 LQFP-ep 10 x 10 64 Because of their small size and heat-dissipating characteristics, QFN IC packages are widely used. Copper lead-frames are used in TQFPs. To accomplish this you must replace a couple of pins, often those found in the central part of the opposing side, with pins that are thicker. Board Assembly Recommendations (QFP) Share. The European Unions Registration Evaluation, Authorization and restriction of Chemicals (EU REACH) that lists the Substances of Very High Concern (SVHC) as well as substances under restriction, REACH Annex XVII. QFPs have small parasitic parameters, and they are also pretty tiny in size. Are there significant manufacturability, prototypability, or cost differences between the two? Variation of COF, where a flip chip is mounted directly to a flex circuit. They are thinner, having a body thickness of only 1.44mm, which means that they can be utilized in components that have height issues. We hope this article has shed light upon any questions you might have had regarding QFPs and QFNs and their differences. QFN packages might suffer from dimensional changes on the part or board in which operate on. There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards. These packages are QFPs with a pretty fine pin pitch just as their name dictates. Read more about cookies. The pins on a DIP IC are spaced 2.54mm apart, which is a standard spacing, perfect for fitting into breadboards, veroboards, and other prototyping boards. Smaller variants of the standard QFP package include thin QFP (TQFP), very-thin QFP (VQFP), and low-profile QFP (LQFP) packages. All IC packages fall into two broad categories by mounting style through-hole (PTH) and surface-mount (SMT). The packaging mainly serves three purposes first, it protects the semiconductor circuit from physical impairment or damage. Solder these replacement pins onto a larger pad on the print circuit board with a large copper area. They hence become less robust whenever they experience some nominal CM or OEM practices. You can therefore do the direct soldering of the packet onto your PCB when you wish to gain optimum transfer of heat from your die. Ultimately, the distinctions between these two packages are so subtle that it barely makes a difference which one you choose. As for the multiple row QFNs, they undergo copper etching processes to produce the number of rows and pins preferred by the manufacturer. What is the difference between LQFP and TQFP? Quarter-size small-outline package (QSOP): with pin spacing of 0.635mm. PPM = (mass of substance / mass of material) * 1,000,000 * total amount of each RoHS substance contained in the material. Though surface-mount technology succeeded plated through-hole (PTH), through-hole is still used in commercial circuits wherever surface-mount is not suitable. Network Consists of Further Focused Websites (Channels), All About Points, Achievement Unlocks & Gaining Ranks, Top 10 Users on ElectronicsForU's Leaderboard, Amazing DIY projects. Developed by. Quad Flat Package (QFP): QFP emerged as the new generation high density surface mount solution to the cost pressure on the electronic component manufacturers and users. 505 Xinhua Road Xinhua District, Shijiazhuang Hebei China. If you plan to transport them, we recommend that you pack them on special waffle packaging for adequate protection. There's a standard IPC-7351A which describes method to design land patters. Spacing between pins can vary. . The packaging decides a lot of things. Low-profile quad flat-package : 1.4 mm high, varying sized and pins on all four sides; Plastic quad flat-pack , a square with pins on all four sides, 44 or more pins; Ceramic quad flat-pack : similar to PQFP; Metric quad flat-pack : a QFP package with metric pin distribution; Thin quad flat-pack , a thinner version of LQFP It only takes a minute to sign up. 49.00 (inc GST) 41.53 (+18% GST extra) Purchase this product now and earn 1 Robu Point! Other types are proprietary designations that may be made by only one or two manufacturers. Unlike DIP having two sides, QFP IC has pins on all four sides. The QFP means (quad flat pack). (The lead pitch and body size are smaller.) Secondly, it protects the circuit from corrosion. HTQFP48 SOT545-2 Not suitable for wave soldering.